Connection mechanism for thin film stimulation leads
US12226637B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2021 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2043 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/0556
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A lead assembly includes a thin film body supporting a plurality of electrodes configured to provide electrical stimulation or sensing. The thin film body includes a substrate. A plurality of electrode connection traces is situated on the thin film body and electrically connected to respective ones of the plurality of electrodes. A connection wire is configured to provide stimulation or sensing signals for transmission to the plurality of electrodes. The connection wire extends from a lead and is substantially larger than each of the electrode connection traces. A coupling structure is configured to provide electrical connection between the connection wire and the electrode connection traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.