Method of manufacturing capacitive micromachined ultrasonic transducer (CMUT)
US12226799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2020 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Oct 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a capacitive micromachined ultrasonic transducer (CMUT) includes the steps of: a) forming a first dielectric layer on a first substrate; b) forming a second dielectric layer on a second substrate; c) forming a cavity in the first or second dielectric layer; d) assembling the first and second substrates by direct bonding of the surface of the second dielectric layer opposite to the second substrate to the surface of the first dielectric layer opposite to the first substrate; e) removing the second substrate to only keep above the cavity a suspended membrane formed by the second dielectric layer; and f) forming an upper electrode on the surface of the membrane opposite to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.