Method for joining metal materials and controlling bonding quality thereof
US12226848B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Sep 22, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Feb 16, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0/T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.