Surface processing method and structure
US12226853B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jul 10, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a surface treatment method of a metallic material having a protective layer formed thereon. A surface of the protective layer is scanned while irradiating the surface and the surface is scanned while moving an irradiation spot along the surface, in a state in which a side layer of the protective layer along the metallic material remains covering the metallic material, and a side layer of the protective layer opposite to the metallic material side is removed by irradiation with the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.