Patent · US Active

Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer

US12226856B2 · kind B2 · utility

0Cited by

16References

13Claims

0Family size

Assignee

ROGERS GERMANY GMBH · DE

Inventors

Stefan Britting · Schnaittach, DE
Tilo Welker · Neuhaus, DE
Karsten Schmidt · San Diego, US

Key dates

Filing date	Dec 3, 2020
Grant date	Feb 18, 2025
Priority date	—
Expiry date	Apr 22, 2041

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/72
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.