Method and apparatus for layer thickness control in additive manufacturing
US12226960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An additive manufacturing apparatus is disclosed. The apparatus includes a build surface, at least a portion of which is transparent. The apparatus includes a first material depositor operable to deposit a curable resin to form a deposited resin layer on the build surface. A first sensing device is configured to measure the thickness of the deposited resin layer; and wherein the at least one sensing device is configured to generate a signal indicative of the thickness of the deposited resin layer. The first sensing device can be connected to a computer such that the additive manufacturing apparatus is configured to control the thickness of the deposited resin layer. The thickness of the deposited resin layer can be controlled such that it varies from side to side. The thickness can also be controlled such that it varies with time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.