Polishing composition comprising polishing particles having high water affinity
US12227674B2 · kind B2 · utility
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Key dates
| Filing date | Jul 20, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jul 20, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1409
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition having silica-based abrasive grains and a polishing method. A polishing composition having silica particles, wherein on the basis of a colloidal silica dispersion of the silica particles, the dispersion has an Rsp of 0.15 to 0.7 as measured using pulse NMR, and the colloidal silica particles have a shape coefficient SF1 of 1.20 to 1.80, wherein Rsp is calculated based on equation (1): Rsp=(Rav−Rb)/(Rb) (1)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.