Expandable structural adhesive film for dissimilar metal bonding
US12227680B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Sep 23, 2020 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.