Patent · US Active

Expandable structural adhesive film for dissimilar metal bonding

US12227680B2 · kind B2 · utility

0Cited by
4References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 23, 2020
Grant dateFeb 18, 2025
Priority date
Expiry dateJul 25, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2463/00
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.