Methods for laser bonding optical elements to substrates and optical assemblies fabricated by the same
US12228772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jan 26, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4237
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.