Three-dimensional object part segmentation using a machine learning model
US12229883B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 29, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/07
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and techniques are provided for part segmentation. For example, a process for performing part segmentation can include obtaining a three-dimensional capture of an object. The method can include generating one or more two-dimensional images of the object from the three-dimensional capture of the object. The method can further include processing the one or more two-dimensional images of the object to generate at least one two-dimensional bounding box associated with a part of the object. The method can include performing three-dimensional part segmentation of the part of the object based on a three-dimensional point cloud generated from the one or more two-dimensional images of the object and the at least one two-dimensional bounding box and based on semantically labeled super points which are merged into subgroups associated with the part of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.