Method for actuating a bonding head
US12230599B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2019 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75901
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.