Construction techniques for hearing instruments
US12231856B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Sep 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2225/77
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a hearing instrument includes placing a component support structure at least partially in a bath of a resin liquid, wherein one or more operative components of the hearing instrument are attached to or contained within the component support structure prior to the component support structure being at least partially placed in the bath of the resin liquid. While the component support structure is at least partially in the bath, volumetric 3-dimensional (3D) printing is performed to form a shell of the hearing instrument attached to the component support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.