Stiffener ring and surface packaging assembly
US12232250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jun 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10424
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.