Electronic device having multilayered substrate and manufacturing method thereof
US12232260B2 · kind B2 · utility
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19References
20Claims
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Key dates
| Filing date | Sep 7, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Apr 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes: a multilayered base substrate including a plurality of substrate bases stacked on each other; a first conductive via and a second conductive via penetrating the substrate bases and spaced from each other; a conductive line electrically connecting the first conductive via and the second conductive via to each other and disposed on at least one of the substrate bases of the plurality of substrate bases; and an open stub including a first end and a second end, wherein the first end is connected to a connector of the conductive line, and the second end is opened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.