Patent · US Active

Tempest seal for modular data centers

US12232289B2 · kind B2 · utility

0Cited by

0References

2Claims

0Family size

Assignee

Dell Products L.P. · US

Inventors

Tyler B. Duncan · Austin, US
Anthony Middleton · Cedar Park, US
Jeffery Todd Sayles · San Marcos, US

Key dates

Filing date	Oct 20, 2022
Grant date	Feb 18, 2025
Priority date	—
Expiry date	Jun 29, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K9/0015
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a first scaffold; and a modular environmental control component (MECC), in which the MECC includes a second scaffold, in which the first scaffold is connected to the second scaffold to form a scaffold interface, in which an enclosure component is affixed to an outside surface of the first scaffold and to an outside surface of the second scaffold, and in which, once affixed to the first scaffold and to the second scaffold, the enclosure component overlaps at least a portion of the scaffold interface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.