Display substrate motherboard and preparation method thereof, display substrate and preparation method thereof
US12232370B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 25, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Sep 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An Organic Light-Emitting Diode display substrate and a preparation method thereof. The Organic Light-Emitting Diode display substrate includes: a first flexible organic layer; a first inorganic layer on the first flexible organic layer; a second flexible organic layer on the first inorganic layer; a pixel driving circuit layer on the second flexible organic layer; a light-emitting element layer on the pixel driving circuit layer, and a thickness of the first flexible organic layer is 5 μm-20 μm, a thickness of the first inorganic layer is 0.4 μm-0.5 μm, and a thickness of the second flexible organic layer is 5 μm-20 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.