Hermetic assembly and device including same
US12233477B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2024 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Jan 5, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.