Substrate support device
US12233501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Aug 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a substrate support device. The substrate support device includes a substrate support part on which a wafer is deposited, the substrate support part including a first mesh electrode and a second mesh electrode disposed under the first mesh electrode; a chucking circuit configured to apply a DC voltage to the first mesh electrode; and an edge control circuit configured to control timings of operations related to the first mesh electrode and the second mesh electrode and control RF (Radio Frequency). The second mesh electrode is divided into a plurality of second sub-mesh electrode to remove an induced electromotive force generated due to a closed loop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.