Solid-state additive manufacturing methods for compounding conductive polymer compositions
US12233592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2021 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Sep 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Solid-state additive manufacturing methods for compounding conductive plastic compositions, fabrication of conductive plastic parts and conductive coatings, and plastic recycling are disclosed. Electrically conductive or thermally conductive plastic compositions are compounded and subsequently printed with the solid-state additive manufacturing system. The solid-state fabricated compositions, parts and coatings can also be manufactured to be both thermally and electrically conductive. Solid-state plastic waste recycling methods are also disclosed where various plastic waste materials and shapes are solid-state processed. The plastic waste can be mixed with virgin plastic material or mixed with other types of materials such as metals, ceramics or their combination. The waste plastic feedstock is reinforced with different types of reinforcing particles or fibers, or various additives are added for improving properties of the final deposits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.