In-mold electronic component and method for manufacturing the same
US12233630B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
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Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Dec 11, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An in-mold electronic component includes a first film layer, a functional module, a plastic layer, and a lead-out terminal. The first film layer is provided at a top surface of the in-mold electronic component. The functional module includes a circuit layer and an electronic component electrically connected to circuit layer. The plastic layer is configured to seal the functional module. One end of the lead-out terminal is electrically connected to the circuit layer, and the other end of the lead-out terminal is led out to a rear surface of the in-mold electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.