Method and apparatus for manufacturing nanostructures from a material layer having a thickness below 1 μm

US12235576B2 · kind B2 · utility

Assignee

• Julius-Maximilians-Universitat Wurzburg · DE

Inventors

• Enno Schatz · Würzburg, DE
• Bert Hecht · Riehen, CH
• Thien Le · Santa Clara, US
• Henriette Maass · Würzburg, DE

Key dates

• Filing date: Jan 24, 2020
• Grant date: Feb 25, 2025
• Expiry date: Sep 13, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B82Y40/00
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Provided is a method and an apparatus of manufacturing nano-structures by cutting out portions of a material layer and removing the cut-out portions.