Flexible circuit board and manufacturing method thereof, touch panel and manufacturing method thereof
US12236028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2020 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Jul 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board has a first binding area and a bending area. The flexible circuit board includes a flexible substrate, a conductor layer, a first protective layer, and a plurality of first binding pins. The plurality of first binding pins is arranged in the first binding area on the flexible substrate. The orthographic projection on the flexible substrate of an edge line of each first binding pin is located within the edge of the flexible substrate, wherein the edge line is located at an end along the extension direction of the first binding pin. The conductor layer is arranged in the bending area on the flexible substrate. The conductor layer is connected with the first binding pins. The first protective layer is arranged on the side of the conductor layer away from the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.