Optical end-pointing for integrated circuit delayering; systems and methods using the same
US12236573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2021 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Feb 17, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems for determining an end-point of a delayering process using optical end-point detection are described. In embodiments, the systems include a controller with an optical end-pointing (OE) module that is configured to determine an end-point of a delayering process based at least in part on the color or thickness of a surface layer of an integrated circuit (IC). In embodiments, the OE module determines whether an end-point of the delayering process has been reached based at least in part on a comparison of a determined thickness of an IC surface layer to a target thickness. The thickness of the surface layer may be determined by the OE module using a machine learning model, such as a convolutional neural network. Methods of identifying an end-point of a delayering process are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.