Plasma ion processing of substrates
US12237150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Mar 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3365
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for plasma ion processing is described, including flowing a gas into porous material; and exposing the gas to a pulsed electric field whilst the gas is in the pores. The pulsed electric field ionises the gas to generate a plasma. The method may additionally include exposing the porous material to a gas so as to generate functionality. The method may additionally include exposing the functionalised porous material to a functional species so as to covalently attach said functional species to the surfaces of the pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.