Patent · US Active

Plasma ion processing of substrates

US12237150B2 · kind B2 · utility

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16Claims
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Assignee

Inventors

Key dates

Filing dateOct 16, 2020
Grant dateFeb 25, 2025
Priority date
Expiry dateMar 26, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/3365
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A method for plasma ion processing is described, including flowing a gas into porous material; and exposing the gas to a pulsed electric field whilst the gas is in the pores. The pulsed electric field ionises the gas to generate a plasma. The method may additionally include exposing the porous material to a gas so as to generate functionality. The method may additionally include exposing the functionalised porous material to a functional species so as to covalently attach said functional species to the surfaces of the pores.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.