Semiconductor package and method for fabricating the same
US12237253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first connection extending in a second direction intersecting the first direction and connecting the first extension and the second extension, and a redistribution structure that covers an upper surface of the pad insulating film, first interposer bumps on a lower surface of the interposer and spaced apart from each other, at least a part of each of the first and second extensions being connected to one of the first interposer bumps, and a first semiconductor chip on an upper surface of the interposer and electrically connected to the redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.