Electronic package and implantable medical device including same
US12237281B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2021 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | May 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.