Cooperative bonding method for a bonding head of a wire bonding machine and a wire bonding machine
US12237298B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2024 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Oct 12, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78901
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.