Patent · US Active

Interconnect system for high current conductor to circuit board

US12237595B2 · kind B2 · utility

0Cited by
6References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 13, 2022
Grant dateFeb 25, 2025
Priority date
Expiry dateJun 28, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/1031
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An electrical interconnect including slotted lug with a receiving end for connecting to a flat electrical conductor and a fastening end for connecting to a surface mount terminal extending from the surface of a circuit, such as an integrated metal substrate (IMS) circuit board or a circuit card assembly. The interconnect provides a secure connection capable of transmitting a current of at least 100 Arms, to give a non-limiting example value. The interconnect further provides low contact resistance and ease of manufacturing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.