Devices and methods related to integrated front-end architecture modules for carrier aggregation
US12237849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Apr 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W84/042
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Circuitry, modules, devices, and methods for integrating front-end carrier aggregation architecture are disclosed. In some embodiments, a method can include providing a packaging substrate configured to receive a plurality of components. The method can also include providing a front-end architecture implemented on the packaging substrate, the front-end architecture including a switching assembly configured to provide switching for two or more frequency bands, the switching assembly including at least one coupler configured to couple a signal associated with the switching assembly, and a diplexer circuit including a first filter configured to pass a first frequency band, a second filter configured to pass a second frequency band, and a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first and second frequency bands from the front-end architecture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.