Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution
US12238851B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Oct 28, 2022 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | May 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/40
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.