Heat sink and electronic device
US12238853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Aug 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.