Immersion cooling for integrated circuit devices
US12238892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2020 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Apr 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3675
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.