Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus
US12238897B2 · kind B2 · utility
0Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2022 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Jul 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4068
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.