Method for forming dye sublimation images in and texturing of solid substrates
US12240267B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2024 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C1/24
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for texturing a plastic substrate, while forming a dye sublimation image, wherein the plastic substrate has a first side and a second side is provide. A first side of a dye carrier sheet having an image of a dye sublimation ink is placed on a base. The first side of the plastic substrate is placed on a second side of the dye carrier to form a stack. A first side of a textured cover is placed on the second side of the plastic substrate. A clamping pressure is provided. The stack is heated to at least a sublimation temperature of the stack, causing the dye sublimation ink to sublimate and penetrate through the first side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.