BHM in adhesive compositions
US12240999B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2022 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jul 8, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance of greater than 40 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.