Preparation method for W-Cu composite plate with Cu phase in finger-shaped gradient distribution
US12241142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2022 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Nov 11, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A preparation method for a W—Cu composite plate with a Cu phase in finger-shaped gradient distribution is provided. The method includes adding WOX powder obtained with ammonium metatungstate as a raw material into W powder through a combustion synthesis method, adding a binder and a pore-forming agent to prepare a slurry, then performing tape casting, soaking in water and sintering to obtain a W framework with pores in finger-shaped distribution, and then infiltrating Cu to obtain a target product. The Cu phase in the W—Cu composite material prepared by the present method is distributed in a finger-shaped gradient manner from an infiltration surface to the interior of a specimen, the Cu phase and the W phase are mutually pinned, and the W—Cu interface has good bonding strength. The present method has the characteristics of adjustable material component performance, simple process, low cost, suitability for large-scale production and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.