Patent · US Active

Method for producing a chip card, card body for a chip card, and chip card

US12242910B2 · kind B2 · utility

0Cited by

1References

11Claims

0Family size

Assignee

GIESECKE+DEVRIENT EPAYMENTS GMBH · DE

Inventor

Michael Baldischweiler · Munich, DE

Key dates

Filing date	Feb 2, 2022
Grant date	Mar 4, 2025
Priority date	—
Expiry date	Feb 2, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07745
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.