Demountable solder joints for coupling superconducting current paths
US12243682B2 · kind B2 · utility
0Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2021 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Oct 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E40/60
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.