P-GaN high electron mobility transistor (HEMT) with MOS2-based 2D barrier
US12243928B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2024 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Oct 15, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bandgap tuneable p-GaN high electron mobility transistor (HEMT) having a structure stacked on a silicon carbide substrate. The device incorporates an indium nitride nucleation layer, followed by an aluminum nitride nucleation layer, and a first aluminum gallium nitride buffer layer. A gallium nitride channel layer is deposited on this stack, with an aluminum source and a drain contact at either end. The bandgap tuneable p-GaN HEMT includes a two-dimensional molybdenum disulfide layer over the channel, covered by a second AlGaN buffer layer. A p-type gallium nitride cap layer and a platinum gate contact complete the structure. This configuration facilitates bandgap tuning and strain engineering, enhancing electron mobility and density in the two-dimensional electron gas region, making it suitable for high-power and high-frequency applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.