Display device using micro LED having outward protrusion for assembly and manufacturing method therefor
US12243964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2019 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Dec 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/032
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.