Printed circuit board and electronic device including same
US12245373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2022 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Mar 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.