Three-dimensional patterned module exterior surface for improved heat dissipation and method of fabricating

US12245382B2 · kind B2 · utility

Assignee

• Qorvo US, Inc. · US

Inventors

• Loizos Loizou · Grasbrunn, DE
• Tobias Mangold · Weilheim, DE
• Andreas Link · Munich, DE

Key dates

• Filing date: Nov 18, 2022
• Grant date: Mar 4, 2025
• Expiry date: Jun 24, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10431
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.