Motor controller heat dissipating systems and methods
US12245408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Mar 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10666
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.