Semiconductor device, method of manufacturing the same and electronic device including the same
US12245442B2 · kind B2 · utility
0Cited by
5References
30Claims
0Family size
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Key dates
| Filing date | Jul 31, 2017 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a substrate, a first source/drain layer, a channel layer and a second source/drain layer stacked on the substrate in sequence, and a gate stack surrounding a periphery of the channel layer. The channel layer includes a semiconductor material causing an increased ON current and/or a reduced OFF current as compared to Si.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.