Liquid ejection head substrate, liquid ejection head, and liquid ejection apparatus
US12246536B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Oct 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14032
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a technique that enables voltages to be applied, with high precision, to an electrode layer for inhibition and removal of koge while suppressing increase in the size a substrate. A liquid ejection head substrate includes: electrothermal conversion elements that apply heat to a liquid; an upper electrode part in which a plurality of upper electrodes that protect the electrothermal conversion elements are formed at positions where the upper electrodes come into contact with the liquid; a counter electrode part which is provided to correspond to the upper electrode part and in which a plurality of counter electrodes are formed to be electrically connectable to the upper electrodes via the liquid; and a generation unit that generates a voltage to be applied to at least one of the upper electrode part and the counter electrode part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.