Metal foil with carrier
US12247280B2 · kind B2 · utility
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10Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 21, 2021 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Aug 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/016
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.