Module for integrating into a card body of a smart card, smart card, and method of implanting a module into a card body of a smart card
US12248833B2 · kind B2 · utility
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0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2021 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.