Thermalization and attenuation of signals within quantum computing systems via directional couplers
US12248851B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2023 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Sep 7, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N10/40
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This disclosure is directed to a quantum computing system (QCS) that includes a cryogenic sub-system, a signal-generating element, a first signal-splitting element, a first transmission path, a second transmission path, a third transmission path, and a quantum device. A first environment is located outside the cryogenic sub-system and a second environment is associated with the cryogenic sub-system. The signal-generating element generates a first signal. The first signal-splitting element is positioned within the second environment. The quantum device is positioned within the cryogenic sub-system. The first transmission path transmits the first signal from the signal-generating element to the first signal-splitting element. The first signal-splitting element subdivides the first signal into a second signal and a third signal. The third transmission transmits the third signal from the first signal-splitting element to the first environment. The second transmission path transmits the second signal from the first signal-splitting element to the quantum device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.