Multilayer electronic component
US12249466B2 · kind B2 · utility
0Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2024 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Jan 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.