Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure
US12249493B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2023 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Apr 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.